Available Testing Services of Each Laboratory：

• The thermal analysis lab can test the glass transition temperature (Tg), thermal expansion coefficient (CTE), thermal decomposition temperature (Td) and other properties of electronic circuit base materials.

• The thermal analysis lab can test the glass transition temperature (Tg), thermal expansion coefficient (CTE), thermal decomposition temperature (Td) and other properties of electronic circuit base materials.

• The physical and mechanical performance lab provides tensile test, normal/high temperature three-point bending test, pull-off test, normal/high temperature anti-peeling test, drop-hammer impact test, UL94 flammability, pressure vessel integrity test, punching ability, punching shear strength and others.

• The environmental lab can meet various pre-test processing condition requirements,and can conduct CAF test, HAST test, thermal shock test and others.

• The metallographic analytical lab & SEM lab can provide cross-section and component shape measurement and owns industry-leading three-dimensional topographical representation ability. The lab also provides nano-scale topographic observation measurement and element composition analysis.

• The thermal conductivity lab can conduct thermal conductivity analysis test for thermal conductive materials.

• The chemical analysis lab provides halogen content analysis test, molecular weight distribution, composition, content, purity, compound structure characterization, board moisture test, exhaust gas concentration test and others.

• The high frequency and high speed lab can provide tests for Dk/Df performance of electronic circuit base materials as well as Signal Integrity (SI) test for PCB.

• The aging lab can provide long term thermal aging test for electronic circuit base materials.